The Corporate Liaison Program (CLP) Day is a periodic meeting where ICFOnians, representatives of international platforms, multinational corporations, local business representatives and researchers of other institutions have the opportunity to interact with experts from around the world in a particular sector to review the latest advances in photonic technologies while focusing on the generation of joint research projects.

In the context of the PIXEurope Pilot Line - coordinated by ICFO and co-funded by the Chips Joint Undertaking and participating Member States, this year’s CLP Day will be substituted by PIXEurope Connect – Industry Ecosystem Building Day, which  will bring together end-users, technology providers, industry leaders and policymakers around this integrated photonics Pan-European initiative.